Qualcomm launched two new chips today at the Mobile World Congress 2014. The company has developed these microprocessors to suit mid-to-high end devices and to some extent, they’ve created them to for the Chinese markets. Both quad-core and octa-core SoCs were presented at MWC, along with a wireless chip dubbed the Gobi 9×30 which is aimed at the automotive sector.
The two chips are pretty similar under the hood with the 410 model, which means that manufacturers won’t have a problem equipping these SoCs on numerous models. In terms of availability, Qualcomm announced that the new chips will be shipped to manufacturers in Q3 this year, while devices working on this platform are expected to hit the market in late Q4.
Qualcomm Snapdragon 610 & 615
The Qualcomm Snapdragon 610 is the quad-core model, followed by the bigger Snapdragon 615 which comes with an octa-core 64-bit ARM Cortex A53 chip. Both of these microprocessors come equipped with third generation 4G LTE, 3G technology, 802.11ac WiFi, HSPA+ and CDMA as well as the Adreno 405 GPU. Although pretty powerful, Qualcomm officials are not regarding these chips as high end, stating that they are still 600 series (as opposed to their high-end 800 models.)
More interesting is the fact that Qualcomm admits that the number of cores present in the 615 model won’t be impacting the performance too much, but they went with an octa-core design to please the Asian markets where users prefer multi-core devices regardless of the the fact that they won’t see a huge improvement over the quad-core chips. Later this year, Qualcomm will be building reference chips of the two new models, so that headset manufacturers can start building their devices.