Vivo has officiated the much awaited XPlay 5 and the XPlay 5 Ultimate Edition at an event in Beijing, China. Vivo XPlay 5 has been fuelling the rumor mills from almost two years, yes you heard it right two years for a smartphone! Fast forward 2016 and the device has been made official, but this time around the specs seem to have changed a lot. But the real surprise comes in the form of the Vivo XPlay 5 Ultimate Edition which will top the spec chart with its 6GB LPDDR4 RAM.


The Vivo XPlay 5 Ultimate Edition houses a Snapdragon 820 under the hood and is clad in a Aluminium-Magnesium alloy casing which apart from imparting the looks will also render a higher degree of strength for the phone. The XPlay 5 Ultimate Edition comes equipped with a 5.43-inch Super AMOLED display with 2.5D glass and Gorilla Glass 4 protection. The XPlay 5 is powered by the mid-range Snapdragon 652 along with 4GB of RAM. On the storage front, both the XPlay X5 and the XPlay X5 Ultimate Edition offer 128GB of internal storage and comes backed with a 3,600mAh battery along with fast charging support.

Just like most of the other smartphones, the Fingerprint sensor sits at the back and the company claims that it can unlock the phone in 0.2 seconds. Both the new smartphones retain the split screen multitasking which was first seen in the Vivo X6 and the X6 Plus. The imaging department is graced by a 16-Megapixel primary sensor and an 8-Megapixel secondary sensor.


Vivo has packed in two-audio chips, C S4398+A S45257 which are expected to work in tandem with the new XE100 headphones. The Vivo XPlay 5 and the XPlay 5 Ultimate Edition both will be running Android Marshmallow 6.0 along with the FunTouch OS. On the connectivity front the devices tout a dual-SIM support, NFC, USB Type-C and Bluetooth.

The Vivo XPlay 5 will be available starting from March 16 and will be priced 3698 yuan (approx $564) and the Ultimate Edition will be priced slightly higher at 4288 Yuan (approx $717).

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Senior Author

Mahit Huilgol is a Mechanical Engineering graduate and is a Technology and Automobile aficionado. He ditched the Corporate boardroom wars in the favor for technology battle ground. Also a foodie by heart and loves both the edible chips and the non-edible silicon chips.