Meizu has unveiled its latest flagship, the Pro 6 Plus and as an iterative upgrade for the Pro 6, the Plus does come with updated hardware including a bigger and better display unit, new SoC and larger battery. The device comes wrapped in an unibody aluminum build and is reminiscent of the recent Meizu phones. Right below the rear camera unit at the back one could see the LED ring flash which will provide different pitches of artificial lights with the help of the 10 LEDs.


The phone comes powered by a Samsung Exynos 8890 SoC, yes the same one used in the Galaxy S7 and is paired with a generous 4GB of RAM. The Meizu Pro 6 Plus sports 5.7-inch OLED display set at a resolution of 2560 x 1440 (QHD) along with the 2.5D protective glass. On the storage front, the device will be offered in both 64GB and 128GB variant (UFS 2.0). Both the variants will come with an mTouch fingerprint sensor and will be available in Dark Grey, Gold and Silver color options.

The imaging setup on the device includes a 12-Megapixel IMX386 primary sensor with 4-axis OIS, 6P lens, f/2.0 aperture, PDAF , nd autofocus. The secondary camera is made up of  5-Megapixel wide-angle lens and the customary built in beauty modes. Meizu Pro 6 Plus is the first phone to run on the Meizu’s proprietary Flyme 6 and will be based on Android 6.0.1. As per Meizu the Flyme 6 apparently comes with 400 new features and is also powered by an “AI Engine” that the company calls One Mind. Also, the Pro Plus comes with the 3D touch that currently works only on the inbuilt apps. The device will be backed up by a 3,400mAh battery that supports mCharge fast charging.

Meizu has also taken care of the Audio part by offering ES9018 and ADA4807 audio chips that bring in Hi-Fi audio. Connectivity features on the phone include Wi-Fi 802.11, Bluetooth 4.1 LE, 3.5 mm headphone jack, USB Type-C and GPS/GLONASS.

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Senior Author

Mahit Huilgol is a Mechanical Engineering graduate and is a Technology and Automobile aficionado. He ditched the Corporate boardroom wars in the favor for technology battle ground. Also a foodie by heart and loves both the edible chips and the non-edible silicon chips.